1. 2. 3. material content data sheet sales product name ipu60r2k0c6 issued 29. september 2015 ma# ma001402334 package pg-to251-3-341 weight* 387.39 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.272 0.33 0.33 3282 3282 leadframe non noble metal iron 7439-89-6 0.248 0.06 641 inorganic material phosphorus 7723-14-0 0.075 0.02 192 non noble metal copper 7440-50-8 248.124 64.06 64.14 640508 641341 wire non noble metal aluminium 7429-90-5 0.441 0.11 0.11 1138 1138 encapsulation organic material carbon black 1333-86-4 0.394 0.10 1017 plastics epoxy resin - 11.948 3.08 30843 inorganic material silicondioxide 60676-86-0 118.957 30.71 33.89 307076 338936 leadfinish non noble metal tin 7440-31-5 3.787 0.98 0.98 9775 9775 plating non noble metal nickel 7440-02-0 0.515 0.13 0.13 1330 1330 solder noble metal silver 7440-22-4 0.041 0.01 105 non noble metal tin 7440-31-5 0.033 0.01 84 non noble metal lead 7439-92-1 1.553 0.40 0.42 4009 4198 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
